Stack assembly having electro-acoustic device

ABSTRACT

Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application No.62/572,511 filed Oct. 15, 2017, entitled STACK ASSEMBLY HAVINGELECTRO-ACOUSTIC DEVICE, the disclosure of which is hereby expresslyincorporated by reference herein in its entirety.

BACKGROUND Field

The present disclosure relates to a stack assembly having anelectro-acoustic device.

Description of the Related Art

In radio-frequency (RF) applications, an electro-acoustic device can beutilized to process an RF signal in an acoustic realm. Such a devicetypically includes transducers configured to convert an electromagneticenergy of the RF signal to an acoustic energy, and to convert theacoustic energy back into an electromagnetic energy. While in theacoustic realm, the electro-acoustic device can be configured to providea desirable functionality such as, for example, filtering functionality.

SUMMARY

According to a number of implementations, the present disclosure relatesto a radio-frequency module that includes a packaging substrateconfigured to receive a plurality of components, and an electro-acousticdevice mounted on the packaging substrate. The radio-frequency modulefurther includes a die having a radio-frequency integrated circuit andmounted over the electro-acoustic device to form a stack assembly.

In some embodiments, the electro-acoustic device can be a filter such asa surface acoustic wave (SAW) filter. The radio-frequency integratedcircuit can be configured to amplify a signal, and include an amplifiersuch as a low-noise amplifier. The die associated with such an amplifiercan be, for example, a silicon die. In some embodiments, theradio-frequency module can be, for example, a global positioning system(GPS) module.

In some embodiments, the radio-frequency module can further include amounting layer implemented between the electro-acoustic device and thedie, and be configured to secure the die to the electro-acoustic device.Such a mounting layer can be, for example, a resin.

In some embodiments, the radio-frequency module can further include anovermold implemented over the packaging substrate to encapsulate thestack assembly. In some embodiments, the radio-frequency module canfurther include a conductive layer implemented on an upper surface ofthe overmold and side walls of the radio-frequency module to provide ashielding functionality.

In some embodiments, the electro-acoustic device can include a mountingside configured to allow the mounting of the electro-acoustic device onthe packaging substrate. The mounting side of the electro-acousticdevice include, for example, a plurality of solder balls.

In some embodiments, the die can be configured to allow formation of aplurality of wirebonds to provide respective electrical connectionsbetween the die and the packaging substrate. In some embodiments, thepackaging substrate can have an area that is less than an areaassociated with another packaging substrate configured to receive theelectro-acoustic device and the die in an unstacked manner.

In some teachings, the present disclosure relates to a method forfabricating a radio-frequency module. The method includes forming orproviding a packaging substrate configured to receive a plurality ofcomponents, and mounting an electro-acoustic device on the packagingsubstrate. The method further includes mounting a die having aradio-frequency integrated circuit over the electro-acoustic device toform a stack assembly.

In some embodiments, the mounting of the die can include applying amounting layer between the electro-acoustic device and the die.

In some embodiments, the method can further include forming an overmoldover the packaging substrate to encapsulate the stack assembly. In someembodiments, at least some of the forming or providing of the packagingsubstrate, the mounting of the electro-acoustic device, the mounting ofthe die, and the forming of the overmold can be performed while in apanel format having an array of units, each unit corresponding to aradio-frequency module. In some embodiments, the method can furtherinclude singulating the array of units into a plurality of individualunits. In some embodiments, the method can further include applying aconformal shield coating on upper surface and side walls of each of theplurality of individual units.

In some implementations, the present disclosure relates to a wirelessdevice that includes an antenna configured to receive a signal, and aradio-frequency module configured to filter and amplify the signal. Theradio-frequency module includes a packaging substrate and a filtermounted on the packaging substrate. The radio-frequency module furtherincludes a low-noise amplifier die and mounted over the electro-acousticdevice, such that the signal is filtered by the filter and amplified bythe low-noise amplifier. The wireless device further includes a receiverconfigured to further process the amplified signal.

In some implementations, the present disclosure relates to an assemblyof components for radio-frequency application. The assembly includes anelectro-acoustic device and a die having a radio-frequency integratedcircuit. The die is attached to the electro-acoustic device to form astack, such that the assembly is capable of filtering and amplifying asignal.

In some embodiments, the electro-acoustic device can be a surfaceacoustic wave filter, and the die can be a low-noise amplifier die. Thesurface acoustic wave filter and the low-noise amplifier die can beconfigured to operate in a range of frequency associated with a globalpositioning system (GPS).

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a stack assembly that includes an electro-acoustic deviceand a semiconductor die having a radio-frequency (RF) integrated circuit(RFIC).

FIG. 2 shows an example layout of a module having an electro-acousticdevice and an RFIC die arranged in a non-stack manner.

FIG. 3 shows an example layout of a module having an electro-acousticdevice and an RFIC die arranged in stack manner.

FIG. 4 shows that in some embodiments, the stack of FIGS. 1 and 3 can bea stack having an amplifier die mounted over a filter.

FIG. 5 shows that in some embodiments, a stack can include a surfaceacoustic wave (SAW) filter as an example of the filter of FIG. 4, and asilicon die as an example of the amplifier die of FIG. 4.

FIG. 6 shows an example of an RF circuit that can be implemented in amodule.

FIG. 7 shows an example layout of the architecture of FIG. 6, in which aSAW filter and a low-noise amplifier (LNA) die are arranged in anon-stack arrangement in a module, similar to the example of FIG. 2.

FIG. 8 shows an example layout of the architecture of FIG. 6, in which aSAW filter and low-noise amplifier (LNA) die are arranged in a stackarrangement in a module, similar to the example of FIG. 3.

FIG. 9 shows comparisons of performance parameters between the non-stackconfiguration of FIG. 7 and the stack configuration of FIG. 8.

FIG. 10 shows a comparison of gain plots of the non-stack configurationof FIG. 7 and the stack configuration of FIG. 8.

FIG. 11 shows another comparison of gain plots of the non-stackconfiguration of FIG. 7 and the stack configuration of FIG. 8.

FIG. 12 shows an example in which a stack of an amplifier die such as anLNA die with a filter such as a SAW filter can result in a reduced sizeof a packaging substrate of a module.

FIG. 13 shows that the reduced footprint area provided by the stack ofFIG. 12 can allow use of a higher performance component such as a higherperformance inductor.

FIG. 14 shows that the reduced footprint area provided by the stack ofFIG. 12 can allow use of an additional component.

FIG. 15A depicts a side sectional view of an example stack having asilicon die mounted on a SAW filter with a mounting layer.

FIG. 15B shows a plan view of the example stack of FIG. 15A.

FIG. 16 shows an example SAW filter device having a piezoelectricsubstrate.

FIG. 17 shows that in some embodiments, a SAW filter can include apiezoelectric substrate having a reduced-thickness, with a silicon dieand/or a mounting layer over the piezoelectric substrate countering someor all of any negative effects that may arise from the reduced thicknessof the piezoelectric substrate.

FIG. 18 shows that in some embodiments, a die can be mounted to beoff-centered with respect to the footprint of a SAW filter.

FIG. 19 shows that in some embodiments, a stack can include more thanone die mounted over a SAW filter.

FIG. 20 shows that in some embodiments, a die can be mounted such thatone or more edges of the die overhang corresponding edge(s) of a SAWfilter.

FIG. 21 shows that in some embodiments, a die mounted over a SAW filtermay or may not have a smaller area than the area of the SAW filter.

FIGS. 22A-22H show an example of how a packaged module having one ormore features as described herein can be fabricated.

FIG. 23 depicts an example wireless device having one or moreadvantageous features described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Described herein are various examples of circuits, devices and methodsrelated to a stack assembly that includes an electro-acoustic device.FIG. 1 shows a stack assembly 100 (also referred to herein as simply astack) that includes an electro-acoustic device 110 and a semiconductordie 120 having a radio-frequency (RF) integrated circuit (RFIC). Morespecific examples of the electro-acoustic device 110 and thesemiconductor die 120 are described herein in greater detail.

In some embodiments, the electro-acoustic device 110 can include a firstsurface or side 112 configured to allow mounting of the electro-acousticdevice 110 onto a circuit board. In some embodiments, such a mountingside of the electro-acoustic device 110 can be utilized to mount thestack 100 itself to onto the circuit board.

In the example of FIG. 1, the electro-acoustic device 110 can furtherinclude a second surface or side 114, and the RFIC die 120 can bemounted over such a surface. Examples of how such stacking of the RFICdie 120 over the electro-acoustic device 110 to form the stack 100 aredescribed herein in greater detail.

In the example of FIG. 1, the RFIC die 120 can include a first surfaceor side 122 configured to allow mounting of the RFIC die 120 onto acircuit board. However, instead of being mounted onto the circuit board,the first side 122 can be utilized to mount the RFIC die 120 over thesecond surface 114 of the electro-acoustic device 110.

In the example of FIG. 1, the RFIC die 120 can further include a secondsurface or side 124 configured to provide electrical connections (e.g.,connections for power, control, signal and ground associated with theRFIC on the die). Examples of how such electrical connections can bemade when the RFIC die 120 is in the stack 100 are described herein ingreater detail.

In some embodiments, such as the example of FIG. 1, each of theelectro-acoustic device 110 and the RFIC die 120 can be configured to becapable of being mounted directly on a circuit board such as a packagingsubstrate. Accordingly, FIGS. 2 and 3 show a comparison between a layoutof a module 20 (FIG. 2) having an electro-acoustic device 110 and anRFIC die 120 arranged in an non-stack manner, and a layout of a module200 (FIG. 3) having an electro-acoustic device 110 and an RFIC die 120arranged in stack manner.

More particularly, and referring to FIG. 2, the module 20 is shown toinclude a packaging substrate 22; and an electro-acoustic device 110, anRFIC die 120, and a surface-mount device (SMD) 130 are shown to bemounted directly on the packaging substrate 22. Accordingly, each of thethree foregoing components is shown to occupy a corresponding area onthe packaging substrate 22.

In the example of FIG. 3, the module 200 is shown to include a packagingsubstrate 202; and an electro-acoustic device 110, an RFIC die 120, anda surface-mount device (SMD) 130 are shown to be mounted over thepackaging substrate 202. However, the RFIC die 120 being stacked overthe electro-acoustic device 110 (to yield a stack 100) results in thestack 100 and the SMD 130 occupying corresponding areas on the packagingsubstrate 202.

In the example of FIG. 3, suppose that the electro-acoustic device 110has a larger footprint area than that of the RFIC die 120, and that thefootprint of the RFIC die 120 is within the footprint of theelectro-acoustic device 110 when in the stack configuration. In such aconfiguration, the footprint area occupied by the electro-acousticdevice 110 and the RFIC die 120 is approximately the footprint area ofthe electro-acoustic device 110. Thus, a significant reduction inrequired footprint area on the packaging substrate 202 can be realized.Consequently, one or more overall area dimensions of the module 200 canbe reduced significantly. In FIG. 3, the dashed rectangle 24 indicatesan area occupied by the module 20 of FIG. 2, showing the reduction inthe area occupied by the module 200 having the stack assembly 100.

Referring to the examples of FIGS. 2 and 3, it is noted that in thecontext of footprint areas of components alone, and withoutconsideration of functionality and performance, the reduction in overallfootprint area can be achieved by stacking of two components. In someembodiments, even more reduction in footprint area can be achieved ifall three example components are arranged in a three-component stack.However, a stacking configuration with a plurality of components mayresult in, for example, difficulty or impossibility in manufacturingprocess, non- or reduced-functional configuration, and/or significantdegradation of performance.

Described herein are examples of stack configurations that can providesignificant reductions in footprint area, and also provide significantimprovements in one or more performance parameters. For example, FIG. 4shows that in some embodiments, the stack 100 of FIGS. 1 and 3 can be astack 100 having an amplifier die 120 mounted over a filter 110.Accordingly, the amplifier die 120 and the filter 110 of FIG. 4 can bemore specific examples of the RFIC die 120 and the electro-acousticdevice 110, respectively, of FIGS. 1 and 3. In the example of FIG. 4,surfaces or sides 112, 114 of the filter 110 and surfaces or sides 122,124 of the amplifier die 120 can be similar to those described inreference to FIG. 1.

Although various examples are described herein in the context of theamplifier die 120 and the filter 110, it will be understood that one ormore features of the present disclosure can also be implemented withother types of RFIC die and/or other types of electro-acoustic devices110.

FIG. 5 shows that in some embodiments, a stack 100 can include a surfaceacoustic wave (SAW) filter 110 as an example of the filter 110 of FIG.4, and a silicon die 120 as an example of the amplifier die 120 of FIG.4. Although various examples are described herein in the context of thesilicon amplifier die 120 and the SAW filter 110, it will be understoodthat one or more features of the present disclosure can also beimplemented with other types of amplifier die and/or other types offilter 110.

In the example of FIG. 5, the stack 100 is shown to be part of apackaged module 200. More particularly, the packaged module 200 is shownto include a packaging substrate 202 having various contacts 204, 206implemented on a mounting side. Such electrical contacts can be utilizedto provide electrical connections and/or mounting functionality when thepackaged module 200 is mounted on a circuit board (not shown). It willbe understood that the mounting side of the packaging substrate 202 canbe configured to allow different mounting configurations (e.g.,ball-grid array (BGA), land-grid array (LGA), etc.).

The packaging substrate 202 in the example of FIG. 5 is shown to furtherinclude various contacts on the upper side, and be configured to receivea plurality of components. For example, contacts 216 can be configuredto allow mounting of an SMD 130, contacts 210, 212 can be configured toallow mounting of the SAW filter 110 (e.g., with solder balls 150), andcontacts 214 can be configured to receive respective ends of wirebonds230. The contacts 216 can provide electrical connections and mountingfunctionality for the SMD 130. Similarly, the contacts 210, 212 canprovide electrical connections and mounting functionality for the SAWfilter 110. The contacts 214 can provide electrical connections for thesilicon die 120. It will be understood that other types of mountingand/or electrical connections can be implemented for some or all of thecomponents mounted over the packaging substrate 202.

Although not shown in FIG. 5, in some embodiments, the packagingsubstrate 202 can include various electrical connections and featuressuch as conductive vias, metal traces, ground plane(s) and groundingfeatures to support various electrical connection functionalities forthe module 200. In some embodiments, the packaging substrate 202 can be,for example, a laminate substrate or a ceramic substrate.

In the example of FIG. 5, an underfill 220 is shown to be providedbetween the mounted SAW filter 110 and the packaging substrate 202.Further, an overmold 240 is shown to be formed over the packagingsubstrate 202 so as to substantially encapsulate the various componentsmounted on the packaging substrate 202.

In the example of FIG. 5, the packaged module 200 is shown to include aconductive layer 250 formed on the upper surface and side walls of themodule 200 to provide RF shielding functionality. Examples related tosuch an RF shield can be found in U.S. Publication No. 2017/0117184entitled DEVICES AND METHODS RELATED TO FABRICATION OF SHIELDED MODULES,which is expressly incorporated by reference in its entirely, and itsdisclosure is to be considered part of the specification of the presentapplication.

In the example of FIG. 5, the stack 100 is shown to include the silicondie 120 mounted over the SAW filter 110. More particularly, theunderside of the silicon die 120 is shown to be mounted to the upperside of the SAW filter 110 by a mounting layer 140. Examples related tosuch mounting of the silicon die 120 onto the SAW filter 110 aredescribed herein in greater detail

Configured in the foregoing manner, various electrical connectivity,such as signal and ground connections, can be provided for the SAWfilter 110 through the solder balls 150 and the respective contacts(210, 212) of the packaging substrate 202. Various electricalconnectivity, such as power, control, signal and ground connections, canbe provided for the silicon die 120 through the wirebonds 230 and therespective contacts 214. Accordingly, in the example of FIG. 5, one ormore electrical connections between the SAW filter 110 and the silicondie 120 can be made through one or more of the solder balls 150, one ormore of the electrical connections of the packaging substrate 202, andone or more of the wirebonds 230. It will be understood that in someembodiments, either or both of the SAW filter 110 and the silicon die120 can be configured so that one or more electrical connections can bemade directly therebetween (e.g., through the mounting interface betweenthe SAW filter and the silicon die).

FIG. 6 shows an example of an RF circuit or architecture that can beimplemented in a module (20 or 200). In the example of FIG. 6, such amodule can be configured to filter and amplify a relatively weak signalreceived through an antenna. More particularly, the received signal(RF_IN) can be provided to a filter 110, and the filtered signal can beprovided to a low-noise amplifier (LNA) for amplification. The LNA canbe operated with a bias circuit that provides, for example, supply andbias voltages for one or more amplifying transistors of the LNA. Such abias circuit can be operated with a supply voltage (e.g., VCC) and acontrol signal (e.g., LNA_EN). From the LNA, the amplified signal can beprovided to an output match circuit 132, and the impedance matchedsignal can be provided as an output (RF_OUT) of the module.

In the example LNA architecture of FIG. 6, the filter 110 can be, forexample, a SAW filter; the LNA (and the bias circuit) 120 can beimplemented as, for example, a silicon die; and the output match circuit132 can include, for example, an SMD (130 in FIGS. 2 and 3) such as aninductor. Accordingly, if the filter 110 and the LNA die 120 are not ina stack configuration, such components can be arranged on a packagingsubstrate similar to the example of FIG. 2. If the filter 110 and theLNA die 120 are in a stack configuration, such a stack can be arrangedon a packaging substrate similar to the example of FIG. 3.

In some embodiments, the LNA architecture of FIG. 6 can be configured toprocess signals having frequencies associated with global positioningsystems (GPS). In such a configuration, the module (20 or 200)associated with the LNA architecture can be implemented as a GPS module.

FIG. 7 shows an example layout of the LNA architecture of FIG. 6, inwhich the SAW filter 110 and the LNA die 120 are arranged in a non-stackarrangement in a GPS module 20, similar to the example of FIG. 2. FIG. 8shows an example layout of the LNA architecture of FIG. 6, in which theSAW filter 110 and the LNA die 120 are arranged in a stack arrangementin a GPS module 200, similar to the example of FIG. 3.

Referring to FIG. 7, the GPS module 20 is shown to include a packagingsubstrate 22; and mounted on such a packaging substrate are the SAWfilter 110, the LNA die 120, and an SMD 130 such as an inductor. Variouselectrical connections associated with such components are shown to beprovided by metal traces 30 associated with the packaging substrate 22(and respective vias, if applicable), and wirebonds 32 associated withthe LNA die 120. For the example GPS module 20, overall lateraldimensions are shown to be approximately 1.6 mm×1.3 mm.

Referring to FIG. 8, the GPS module 200 is shown to include a packagingsubstrate 202; and mounted on such a packaging substrate are the stack100 (having the LNA die 120 mounted over the SAW filter 110), and an SMD130 such as an inductor. Various electrical connections associated withsuch components are shown to be provided by metal traces 232 associatedwith the packaging substrate 202 (and respective vias, if applicable),and wirebonds 230 associated with the LNA die 120. For the example GPSmodule 200, overall lateral dimensions are shown to be approximately 1.3mm×1.3 mm, such that the area of the GPS module 200 of FIG. 8 isapproximately 19% less than the area of the GPS module 20 of FIG. 7.

FIGS. 9-11 show various plots associated with the GPS module 20 of FIG.7 and the GPS module 200 of FIG. 8. More particularly, the upper leftpanel of FIG. 9 shows input return loss plots for the “No stack”configuration of FIG. 7 and the “Stack” configuration of FIG. 8, in afrequency range from 1.558 GHz to 1.608 GHz. The upper right panel ofFIG. 9 shows output return loss plots for the “No stack” configurationof FIG. 7 and the “Stack” configuration of FIG. 8, in a frequency rangefrom 1.558 GHz to 1.608 GHz. The lower left panel of FIG. 9 shows Smithchart input contour plots for the “No stack” configuration of FIG. 7 andthe “Stack” configuration of FIG. 8, in a frequency range from 1.558 GHzto 1.606 GHz. The lower right panel of FIG. 9 shows Smith chart outputcontour plots for the “No stack” configuration of FIG. 7 and the “Stack”configuration of FIG. 8, in a frequency range from 1.558 GHz to 1.606GHz.

Referring to the foregoing plots of FIG. 9, it is noted that the inputreturn loss (e.g., upper left panel, at a GPS frequency of 1.575 GHz)associated with the GPS module 200 of FIG. 8 is desirably reduced whencompared to the input loss associated with the GPS module 20 of FIG. 7.It is further noted that the input contour of the Smith chart scan(lower left panel) for the GPS module 200 of FIG. 8 is significantly anddesirably tighter about a desired impedance when compared to thecorresponding scan associated with the GPS module 20 of FIG. 7.

In FIG. 10, gain plots are shown for the “No stack” configuration ofFIG. 7 and the “Stack” configuration of FIG. 8, in a frequency rangefrom 1.558 GHz to 1.608 GHz. In FIG. 11, gain plots are shown for the“No stack” configuration of FIG. 7 and the “Stack” configuration of FIG.8, in a wider frequency range from 0 GHz to 6.0 GHz. Referring to theplots of FIGS. 10 and 11, it is noted that the gain performance of theGPS module 200 of FIG. 8 is not degraded in a significant manner whencompared to the gain performance of the GPS module 20 of FIG. 7.

In some embodiments, the performance improvements described above inreference to FIG. 9 can result from reduction in lengths of metal tracesthat can be utilized in the GPS module 200 of FIG. 8. For example, sincethe SAW filter 110 and the LNA die 120 are stacked, they essentiallyoccupy the same footprint area on the packaging substrate 202. Thus,some or all of electrical connections (e.g., including the signal pathfor the filtered and un-amplified signal from the filter to the LNA) canbe implemented with metal traces having shorter lateral dimensions.Accordingly, undesirable effects such as parasitic capacitance andmismatch can be reduced with such shorter metal traces.

As described herein, stacking of an amplifier die such as an LNA diewith a filter such as a SAW filter can provide a desirable reduction inlateral size of a module. As also described herein, such a reduction inmodule size can also be accompanied with a performance improvement inone or more operating parameters.

FIGS. 12-14 show that the stacking of an amplifier die such as an LNAdie with a filter such as a SAW filter can also provide additionalbenefits in terms of design flexibility. For example, and referring toFIG. 12, suppose that a stack 100 of an amplifier die such as an LNA die120 with a filter such as a SAW filter 110 results in a reduced size ofthe packaging substrate 202 of a module 200, similar to the examples ofFIGS. 3 and 8. Suppose further that the LNA die 120, the SAW filter 110and the inductor 130 are substantially identical individually in themodule 200 and in another module without such a stack (i.e., the die andfilter are arranged in a non-stack configuration). With suchassumptions, the reduced size of the packaging substrate 202 (relativeto a footprint 24 of a module without a stack) can be attributed to thestacking configuration.

It is noted that in some embodiments, the reduced size of the module maybe required or desirable. However, in some embodiments, such reductionmay not be as important. In such an application, one can still utilizethe stack configuration, and the resulting area made available by thestack can be utilized to provide performance improvement for the module.

For example, FIG. 13 shows that a higher performance component 130 suchas a higher performance inductor can be utilized in a module 200 bhaving a space made available by the stack 100. Such a higherperformance inductor (130) is shown to be larger than the inductor ofFIG. 12 (depicted as a dotted rectangle in FIG. 13); however, such alarger inductor can be accommodated by some or all of the space madeavailable by the stack 100. Accordingly, the module 200 b can have asize that is between the size of the non-stack module 24 and the size ofthe module 200 a that is similar to the module 200 of FIG. 12. Further,the performance of the module 200 b can be improved by the use of thehigher performance component 130.

In another example, FIG. 14 shows that an additional component 130 b canbe utilized in a module 200 b having a space made available by the stack100. Such an additional component can be utilized with an existingcomponent 130 a; and its presence can be accommodated by some or all ofthe space made available by the stack 100. Accordingly, the module 200 bcan have a size that is between the size of the non-stack module 24 andthe size of the module 200 a that is similar to the module 200 of FIG.12. Further, the performance of the module 200 b can be improved by theuse of the additional component 130 b.

FIGS. 15-21 show examples of design considerations that can beimplemented for a stack 100 having one or more features as describedherein. FIG. 15A depicts a side sectional view of a stack 100 having asilicon die 120 mounted on a SAW filter 110 with a mounting layer 140(e.g., a resin layer). The SAW filter 110 is shown to include a cavity166 defined by a piezoelectric substrate 164 and a structure 160.Implemented on the cavity surface of the piezoelectric substrate 164 area plurality of interdigital transducers (IDTs) 168 that are coupled tocontacts 162. Thus, an electrical signal provided to an IDT results inan acoustic wave being established with a sharply defined frequency; andsuch an acoustic wave can be converted back to an electrical (filtered)signal through another IDT.

FIG. 15B shows a plan view of the stack 100 of FIG. 15A. In the exampleof FIGS. 15A and 15B, the dimensions listed in Table 1 can be assigned.Some of such dimensions are referenced in the examples of FIGS. 16-21.

TABLE 1 Dimension Part d1 Thickness of lower portion 160 of SAW filterd2 Thickness of piezoelectric substrate 164 d3 Thickness of mountinglayer 140 d4 Thickness of silicon die 120 d5 Overall thickness of SAWfilter 110 d6 Overall thickness of stack 100 d11 First lateral dimensionof SAW filter 110 d12 Second lateral dimension of SAW filter 110 d13First lateral dimension of silicon die 120 d14 Second lateral dimensionof silicon die 120

FIGS. 16 and 17 show that in some embodiments, a stack 100 having one ormore features as described herein can be implemented such that a silicondie 120 mounted on a SAW filter 110 can enhance one or morefunctionalities of the SAW filter 110, and therefore the correspondingmodule. For example, and referring to FIG. 16, suppose that a given SAWfilter 110 has a piezoelectric substrate with a thickness of d2. Whenutilized in a module by itself (e.g., without stacking), such a SAWfilter can provide certain filtering performance and mechanicalproperty.

In some embodiments, the piezoelectric substrate of a SAW filter canprovide mechanical integrity of the SAW filter, and/or impact theacoustic property of the SAW filter. Thus, when another structure suchas a silicon die is mounted on such a substrate, at least the acousticproperty of the SAW filter may be impacted. In the examples describedherein in reference to FIGS. 7-11, the stacking of the silicon die overthe SAW filter (with an original piezoelectric substrate thickness) doesnot appear to negatively impact the filtering performance of the SAWfilter. However, such a stack in the examples of FIGS. 7-11 hasassociated with it an increase in vertical dimension beyond the fullthickness of the original piezoelectric substrate.

In some applications, it may be desirable to reduce the overall heightof a stack having one or more features as described herein. To achievesuch a height reduction, the piezoelectric substrate thickness can bereduced in some embodiments. However, such a thickness reduction canresult in degradation of mechanical integrity of the SAW filter (when byitself) and/or filtering performance.

FIG. 17 shows that in some embodiments, a SAW filter 110 can include apiezoelectric substrate having a reduced-thickness dimension d2′. Insome embodiments, a silicon die 120 and/or a mounting layer 140 over thepiezoelectric substrate can be configured to counter some or all of anynegative effects that may arise from the reduced thickness of thepiezoelectric substrate. Thus, in the example of FIG. 17, thepiezoelectric substrate is shown to have a significantly reducedthickness (d2′) when compared to the original thickness (d2) of FIG. 16.With the addition of the mounting layer 140 and the silicon die 120, theoverall height is shown to be greater than that of the original SAWfilter of FIG. 16, but lower than the height resulting from a stack withthe original SAW filter (with a piezoelectric substrate thickness ofd2).

In some embodiments, a die can be mounted over a SAW filter so as to begenerally centered laterally with respect to the footprint of the SAWfilter. FIG. 18 shows that in some embodiments, a die 120 can be mountedto be off-centered with respect to the footprint of a SAW filter 110. InFIG. 18, the center position on the SAW filter 110 is depicted as adashed rectangle 121. In some applications, such an off-centeredmounting of the die may be desirable to, for example, adjust theacoustic property of the SAW filter, to reduce/increase wirebondlengths, etc.

FIG. 19 shows that in some embodiments, a stack 100 can include morethan one die mounted over a SAW filter 110. For example, first andsecond die 120 a, 120 b are shown to be mounted over the SAW filter 110.Such first and second die may or may not be the same type (e.g., one asilicon die, and the other a non-silicon die), and may or may notprovide similar functionality (e.g., one an amplifier die, and the othera non-amplifier die).

FIG. 20 shows that in some embodiments, a die 120 can be mounted suchthat one or more edges of the die 120 overhang corresponding edge(s) ofa SAW filter 110. Similar to the example of FIG. 18, such an overhangingmounting of the die 120 may be desirable to, for example, adjust theacoustic property of the SAW filter, to reduce/increase wirebondlengths, etc.

In the various examples described herein, a die mounted over a SAWfilter is assumed to have a smaller area than the area of the SAWfilter. FIG. 21 shows that in some embodiments, such an assumption isnot a requirement. For example, in FIG. 21, a die 120 is shown to haveeach of first and second dimensions (d13 and d14 in Table 1) greaterthan respective first and second dimensions (d11 and d12) of a SAWfilter 110. It will be understood that other configurations are alsopossible. For example, a die can have a first dimension greater than afirst dimension of a corresponding SAW filter, but the die's seconddimension can be less than the SAW filter's second dimension. In anotherexample, a die can have a first dimension less than a first dimension ofa corresponding SAW filter, but the die's second dimension can begreater than the SAW filter's second dimension.

FIGS. 22A-22H show an example of how a packaged module having one ormore features as described herein can be fabricated. In FIG. 22A, apackaging substrate 202 can be formed or provided. In some embodiments,such a packaging substrate can be similar to the example described inreference to FIG. 5.

In FIG. 22B, an SMD 130 can be mounted on the packaging substrate 202.In some embodiments, such an SMD can be, for example, an inductor or acapacitor.

In FIG. 22C, a SAW filter 110 can be mounted on the packaging substrate202. In some embodiments, such a mounting of the SAW filter 110 caninclude soldering facilitated by an array of solder balls, and anunderfill process.

In FIG. 22D, a silicon die 120 can be mounted on the SAW filter 110. Insome embodiments, such a mounting of the silicon die 120 can includeforming an assembly 123 of the silicon die 120 and a resin layer 140,followed by placing the assembly 123 on the SAW filter 110. It will beunderstood that in some embodiments, other attachment sequence can beutilized. For example, a resin layer 140 can be placed or formed on theSAW filter 110, and the silicon die 120 without a resin layer can beplaced on the resin layer 140.

In FIG. 22E, a stack 100 is shown to be formed from the mounting of thesilicon die 120 on the SAW filter 110. In some embodiments, such anassembly of FIG. 22E can be subjected to heat to cure the resin layer140 to securely attach the silicon die on the SAW filter 110.

In FIG. 22F, a plurality of wirebonds 230 can be formed between thesilicon die and respective contacts on the packaging substrate 202.

In FIG. 22G, an overmold 240 can be formed over the packaging substrateto encapsulate the stack (100), the wirebonds (230) and the SMD (130).In some embodiments, the assembly in FIG. 22G can be a completed module200, if shielding functionality is not desired or needed.

In FIG. 22H, a conductive layer 250 can be formed on the upper surfaceof the overmold 240 and the side walls of the module 200. In someembodiments, such a conductive layer can be formed utilizing a conformaldeposition technique, such as the examples described in theabove-referenced U.S. Publication No. 2017/0117184. In some embodiments,the assembly in FIG. 22H can be a completed module 200, if shieldingfunctionality is desired or needed.

In the various example stages of FIGS. 22A-22H, fabrication of a singlemodule is described. It will be understood that in some embodiments, anarray of individual units can be processed together while in a panelformat. For example, the packaging substrate 202 of FIG. 22A can be aunit in a panel having an array of such units. With such a panel, stepsassociated with FIGS. 22B-22G can be performed with the units are stillin the panel format. Upon completion of the overmold step of FIG. 22G,multiple modules can be formed by singulating the panel into multipleindividual units. In some embodiments, formation of the conformal shieldcoating 250 can be formed for the singulated individual units utilizingthe example techniques described in the above-referenced U.S.Publication No. 2017/0117184.

In some implementations, an architecture, device and/or circuit havingone or more features described herein can be included in an RF devicesuch as a wireless device. Such an architecture, device and/or circuitcan be implemented directly in the wireless device, in one or moremodular forms as described herein, or in some combination thereof. Insome embodiments, such a wireless device can include, for example, acellular phone, a smart-phone, a hand-held wireless device with orwithout phone functionality, a wireless tablet, a wireless router, awireless access point, a wireless base station, etc. Although describedin the context of wireless devices, it will be understood that one ormore features of the present disclosure can also be implemented in otherRF systems such as base stations.

FIG. 23 depicts an example wireless device 700 having one or moreadvantageous features described herein. As described herein, one or morestacks having one or more features as described herein can beimplemented in a number of places in such a wireless device. Forexample, in some embodiments, a stack 100 as described herein can beimplemented in a module such as a diversity receive (DRx) module 300having one or more low-noise amplifiers (LNAs). In another example, astack 100 as described herein can be implemented in a power amplifiermodule 712.

In yet another example, a stack 100 as described herein can beimplemented in a GPS module 200. Such a GPS module can be configured tofilter and amplify a signal received through a GPS antenna 750.

In the example of FIG. 23, power amplifiers (PAs) in the PA module 712can receive their respective RF signals from a transceiver 710 that canbe configured and operated to generate RF signals to be amplified andtransmitted, and to process received signals. The transceiver 710 isshown to interact with a baseband sub-system 708 that is configured toprovide conversion between data and/or voice signals suitable for a userand RF signals suitable for the transceiver 710. The transceiver 710 isalso shown to be connected to a power management component 706 that isconfigured to manage power for the operation of the wireless device 700.Such power management can also control operations of the basebandsub-system 708 and other components of the wireless device 700.

The baseband sub-system 708 is shown to be connected to a user interface702 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 708 can also beconnected to a memory 704 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In the example of FIG. 23, the DRx module 300 can be implemented betweenone or more diversity antennas (e.g., diversity antenna 730) and the ASM714. Such a configuration can allow an RF signal received through thediversity antenna 730 to be processed (in some embodiments, includingamplification by an LNA) with little or no loss of and/or little or noaddition of noise to the RF signal from the diversity antenna 730. Suchprocessed signal from the DRx module 300 can then be routed to the ASMthrough one or more signal paths.

In the example of FIG. 23, a main antenna 720 can be configured to, forexample, facilitate transmission of RF signals from the PA module 712.In some embodiments, receive operations can also be achieved through themain antenna.

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

1. A radio-frequency module comprising: a packaging substrate configuredto receive a plurality of components; an electro-acoustic device mountedon the packaging substrate; and a die having a radio-frequencyintegrated circuit and mounted over the electro-acoustic device to forma stack assembly.
 2. The radio-frequency module of claim 1 wherein theelectro-acoustic device is a filter.
 3. The radio-frequency module ofclaim 2 wherein the filter is a surface acoustic wave (SAW) filter. 4.The radio-frequency module of claim 1 wherein the radio-frequencyintegrated circuit is configured to amplify a signal.
 5. Theradio-frequency module of claim 4 wherein the radio-frequency integratedcircuit includes a low-noise amplifier.
 6. The radio-frequency module ofclaim 1 wherein the die is a silicon die.
 7. The radio-frequency moduleof claim 6 wherein the radio-frequency module is a global positioningsystem (GPS) module.
 8. The radio-frequency module of claim 1 furthercomprising a mounting layer implemented between the electro-acousticdevice and the die, and configured to secure the die to theelectro-acoustic device.
 9. The radio-frequency module of claim 8wherein the mounting layer includes a resin.
 10. The radio-frequencymodule of claim 8 further comprising an overmold implemented over thepackaging substrate to encapsulate the stack assembly.
 11. (canceled)12. The radio-frequency module of claim 1 wherein the electro-acousticdevice includes a mounting side configured to allow the mounting of theelectro-acoustic device on the packaging substrate.
 13. Theradio-frequency module of claim 12 wherein the mounting side of theelectro-acoustic device includes a plurality of solder balls.
 14. Theradio-frequency module of claim 1 wherein the die is configured to allowformation of a plurality of wirebonds to provide respective electricalconnections between the die and the packaging substrate.
 15. (canceled)16. A method for fabricating a radio-frequency module, the methodcomprising: forming or providing a packaging substrate configured toreceive a plurality of components; mounting an electro-acoustic deviceon the packaging substrate; and mounting a die having a radio-frequencyintegrated circuit over the electro-acoustic device to form a stackassembly.
 17. The method of claim 16 wherein the mounting of the dieincludes applying a mounting layer between the electro-acoustic deviceand the die.
 18. The method of claim 16 further comprising forming anovermold over the packaging substrate to encapsulate the stack assembly.19. The method of claim 18 wherein at least some of the forming orproviding of the packaging substrate, the mounting of theelectro-acoustic device, the mounting of the die, and the forming of theovermold is performed while in a panel format having an array of units,each unit corresponding to a radio-frequency module.
 20. (canceled) 21.(canceled)
 22. (canceled)
 23. An assembly of components forradio-frequency application, comprising: an electro-acoustic device; anda die having a radio-frequency integrated circuit, and attached to theelectro-acoustic device to form a stack, such that the assembly iscapable of filtering and amplifying a signal.
 24. The assembly of claim23 wherein the electro-acoustic device is a surface acoustic wavefilter, and the die is a low-noise amplifier die.
 25. The assembly ofclaim 24 wherein the surface acoustic wave filter and the low-noiseamplifier die are configured to operate in a range of frequencyassociated with a global positioning system (GPS).